[PR] ADATA DRAM Takes a Leap Forward

Taipei, Taiwan – May 30, 2013 – ADATA™ Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today launched a successor to the company’s popular XPG DRAM lineup. The new XPG V2 series are designed for 3rd Generation Intel Core Processors and the Z87 platform, and feature colorful and visually striking heat spreaders.

The XPG V2 modules all feature 2oz copper, 8 layer PCB (Printed Circuit Board) aluminum heat spreaders employing Thermal Conductive Technology (TCT). Additionally, the heat spreaders have been re-designed with a futuristic form that will appeal to those who take pride in both the performance and the visual outlook of their high-end system. The 2800 MHz memory runs at timings of CL 12-14-14-36 at 1.65 volts, delivering the performance demanded by gamers and power users.

The XPG V2 will come in dual channel kits of 8GB and 16GB (4GB x 2 and 8GB x 2).  For more product information, please visit ADATA website at http://www.adata-group.com